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Product Description
SMT is a surface mount technology (short for Surface Mount Technology) called surface mount or surface mount technology. It is currently the most popular technology and process in the electronics assembly industry.
   
It is a type of lead less or short lead surface mount component (referred to as SMC/SMD, Chinese called chip component) mounted on the surface of a printed circuit board (PCB) or other substrate surface. Circuit mounting technology for soldering and assembly by means of reflow soldering or dip soldering.
   
Lead-free and halogen-free solder paste
   
Our lead-free halogen-free series tin paste is made of special flux and very low oxygen content tin silver copper alloy powder. Excellent continuous printing solution; in addition, this product contains flux, using a highly reliable halogen free activator system, so that the residue after welding, even free from washing can also have extremely high reliability.
  
Our No-wash Tin-lead solder paste series uses special solder paste and very low oxygen content Spherical tin-lead alloy powder configuration. Excellent continuous printing solution; in addition, the product contains solder paste, the use of high trust and low ionic halogen activator system, so that its residue after welding, even wash-free can also have extremely high reliability.
 
Operating characteristic
  
1) In continuous printing, the viscosity rarely changes with time, and a very stable printing effect can be obtained.
  
2) For circuits with 4.0mm and above spacing, fine print can be completed
  
3) Excellent weldability, Suitable wetness can be shown in different parts
  
4) Suitable for general atmospheric or nitrogen return welding furnace
  
5) At very high peak temperature, good weldability can also be obtained.
Machines that SMT technology needs to use:

Modern solder paste printing presses generally consist of plates, tin paste, embossing, and circuit boards. Its working principle is: firstly, the circuit board to be printed is fixed on the printing positioning table, and then the solder paste or the red glue is printed on the corresponding pad through the steel mesh by the left and right scrapers of the printing machine, and the PCB is uniformly printed. The transfer station is input to the placement machine for automatic placement.

In the use of printing operations, the speed should not be too fast, otherwise it is likely to cause some places not printed, on the contrary, if the speed is too slow, the printing effect will be uneven. In general, the printing speed is kept within the range of 10-25 mm / sec, which is optimal, so that the printing effect can be optimized.

Mounter: Also known as "mounting machine" or "Surface Mount System", in the production line, it is placed behind the dispenser or screen printer, and the surface is mounted by moving the placement head. The component accurately places a device on the PCB pad. Divided into manual and fully automatic.

Automatic placement machine use requirements

1. Check whether the working temperature, humidity and cleanliness meet the working requirements.

2. After the machine is operated for a certain period of time, the parts will be contaminated with dust, so the parts should be cleaned in time.

3. The machine needs to run uninterruptedly, and the parts are rubbed against each other. In order to ensure that such components can operate normally, it is necessary to add lubricant to ensure that the equipment can reach normal operating conditions.

Reflow soldering technology is no stranger to electronics manufacturing. The components on the various boards used in our computers are soldered to the board by this process. The inside of the device has a heating circuit that uses air or nitrogen. After heating to a high enough temperature, blow to the board that has been attached to the component, and let the solder on both sides of the component melt and bond to the motherboard. The advantage of this process is that the temperature is easy to control, oxidation can be avoided during the welding process, and manufacturing costs are easier to control.

          
Lead free wash solder paste

AOLL

Sn55Pb45

Sn63Pb37

Sn62.8Pb36.8Ag0.4

Sn62Pb36Ag2

Sn43Pb43Bi14

Melting point

183—195℃

183℃

179—183℃

197℃

146℃

Mesh

25—45um

20—45um

20—38um

20—38um

20—45um

Viscosity

190±20Pa.S

190±20Pa.S

190±20Pa.S

190±20Pa.S

190±20Pa.S

Copper Corrosion

PASS

PASS

PASS

PASS

PASS

S.I.R)

>10*1012Ω

>10*1012Ω

>10*1012Ω

>10*1012Ω

>10*1012Ω

Spread

≥90

≥90

≥90

≥90

≥90


Lead-free medium temperature, low temperature solder paste

AOLL

Sn42Bi58

SnBi17Cu0.5

SnBi30Cu50

SnBi35Ag1

SnBi35Ag0.3

Melting point

138℃

190—209℃

149—188℃

151—189℃

138—188℃

Mesh

25—45um

20—45um

25—45um

20—45um

25—45um

Viscosity

190±20Pa.S

190±20Pa.S

190±20Pa.S

190±20Pa.S

190±20Pa.S

Copper Corrosion

PASS

PASS

PASS

PASS

PASS

S.I.R

>10*1012Ω

>10*1012Ω

>10*1012Ω

>10*1012Ω

>10*1012Ω

Spread

≥90

≥90

≥90

≥90

≥90


Lead-free and halogen-free solder paste

AOLL

SnAg3.0Cu0.5

SnAg0.3Cu0.7

Sn99.3Cu0.7

Sn96.5Ag3.5

SnAg4.0Cu0.5

Melting point

217—219℃

227—229℃

227—229℃

221℃

217——219℃

Mesh

25—45um

25—45um

25—45um

25—45um

25—45um

Viscosity

190±20Pa.S

190±20Pa.S

190±20Pa.S

190±20Pa.S

190±20Pa.S

Copper Corrosion

PASS

PASS

PASS

PASS

PASS

S.I.R)

>10*1012Ω

>10*1012Ω

>10*1012Ω

>10*1012Ω

>10*1012Ω

Spread

≥90

≥90

≥90

≥90

≥90


Composition and properties

project

character

alloy composition

Sn96.5/Ag3.0/Cu0.5

Main alloy composition

Sn remaining quantity,Ag3.0+/-0.2,Cu0.5+/-0.05

melting point

217—219℃

Tin particle size

20-38/um

Tin powder shape

spherality

metal content

89.5±1%

Halide Content

<0.015wt%

 viscosity

180±20Pa.s





   

project

character

Electromigration test

1.02×105Ωcm and more than

insulation resistance test

1×109

Fluidity test

Lower than 0.2mm

Melting test

Almost Wuxi ball occurrence

Diffusivity test

More than 89%

Copper mirror corrosion test

Corrosion free case

Residue viscosity test(残渣粘性试验)

qualified(合格)



   
Furnace temperature graph



A、Preheating zone: the heating rate is 1.0-3.0 ℃ / s. The heating rate of the furnace temperature in the preheating zone is too fast, which makes the flow and composition of tin paste change easily, and the phenomena of tin explosion and tin beads are easy to occur.

B、Constant temperature range: 150-180 ℃, time: 90-120S is most suitable. If the temperature is too low, the phenomenon of solder not melting will occur after welding back. (suggested temperature increase speed is less than 2 ℃ / s)

C、Reflow Soldering zone: peak temperature should be set at 240-255 ℃, melting time up 217 ℃ should be adjusted to 30-80S, up 230 ℃ should adjusted to 10-30s.

D、Cooling zone: cooling rate < 4 ℃ / s

project

character

alloy composition

Sn42Bi58

melting point

138℃

Tin particle size

20-45/um

Tin powder shape

spherality

metal content

89.5-91±1%

Halide Content

<0.05wt%

 viscosity

180±20Pa.s





     

project

character

Electromigration test

1.02×105Ωcm and more than

insulation resistance test

1×109

Fluidity test

Lower than 0.2mm

Melting test

Almost Wuxi ball occurrence

Diffusivity test

More than 88%

Copper mirror corrosion test

No penetration corrosion

Residue viscosity test

qualified



   
Lead free wash series

AOLL

Sn55Pb45

Sn63Pb37

Sn62.8Pb36.8Ag0.4

Sn62Pb36Ag2

Sn43Pb43Bi14

Melting point

183—195℃

183℃

179—183℃

197℃

146℃

Mesh

25—45um

20—45um

20—38um

20—38um

20—45um

Viscosity

190±20Pa.S

190±20Pa.S

190±20Pa.S

190±20Pa.S

190±20Pa.S

Copper Corrosion

PASS

PASS

PASS

PASS

PASS

S.I.R

>10*1012Ω

>10*1012Ω

>10*1012Ω

>10*1012Ω

>10*1012Ω

Spread

≥90

≥90

≥90

≥90

≥90

  
Composition and properties

project

character

alloy composition

Sn63Pb37

Main alloy composition

Sn remaining quantity,Pb37+3.0

melting point

183℃

Tin particle size

25-45/um

Tin powder shape

spherality

Flux content

89.5±1%

 viscosity

180±20Pa.s



   

project

character

Electromigration test

1.02×105Ωcm and more than

insulation resistance test

1×109

Fluidity test

Lower than 0.2mm

Melting test

Almost Wuxi ball occurrence

Diffusivity test

More than 89%

Copper mirror corrosion test

Corrosion free case

Residue viscosity test

qualified



     
Furnace temperature graph



A、Preheating zone: the heating rate is 1.0-3.0 ℃ / s. The heating rate of the furnace temperature in the preheating zone is too fast, which makes the flow and composition of tin paste change easily, and the phenomena of tin explosion and tin beads are easy to occur.

B、Constant temperature range: 130-160 ℃, time: 60-150S is most suitable. If the temperature is too low, the phenomenon of solder not melting will occur after welding back. (suggested temperature increase speed is less than 2 ℃ / s)

C、Reflow Soldering zone: peak temperature should be set at 210-230 ℃, melting time up 220 ℃ should be adjusted to 30-90S.

D、Cooling zone: cooling rate < 4 ℃ / s