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Lead-free solder bar

Lead solder bar 4

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Product Description
According to different liquidus temperature critical points, the solder strip has high temperature solder strips and low temperature solder strips.
  
The solder bar in which the liquidus temperature is higher than the tin-lead eutectic melting point--183 degrees is a high-temperature solder bar, and the high-temperature solder bar is a solder bar formed by adding silver, a high proportion of germanium or lead in the solder alloy, and a high-temperature solder bar. It is mainly used for assembly of components that do not change when the motherboard is assembled; the solder bar whose liquidus temperature is lower than the melting point of tin-lead eutectic--183 degrees is a low-temperature solder bar, and the low-temperature solder bar is added with antimony and indium in the solder alloy. Solder bars formed of cadmium are mainly used for assembly of parts with low heat resistance such as microelectronic sensors.
  
According to the chemical nature, the commonly used solder bar types are anti-oxidation solder strips and high-purity low-slag solder strips.
  
Anti-oxidation solder bar: It has good oxidation resistance, high fluidity, strong weld ability, very little scum during melting, and little oxidation in immersion and wave soldering. It is an excellent weld ability of the economical solder bar of tin saving. Solder ability, full and uniform solder joints, excellent soldering results.
  
Our company has many years of research and practical experience in soldering tin bar. In combination with the development direction of green environmental protection in the modern electronics industry and the need for reliable products, high-purity metal raw materials are used for lead-free solder bar production.Under strict quality control, the degree of oxidation and the content of metal and non-metallic impurities are effectively controlled. The surface of the tin strip is smooth and even, the purity is high, the fluidity after melting is good, the weld ability is excellent, the solder joint is bright, and the oxide residue is Rarely appear. Our solder bar is suitable for all kinds of wave soldering and manual welding with high quality requirement. Our company will also continue to research and develop, provide a variety of alloy proportion of various types of lead-free tin bars for customers to choose.
   
Since Producing area is different, the structure of impurities in tin strips is also different. Therefore, manufacturers are required to rigorously select raw material suppliers to ensure high-quality raw materials. In addition, in the production process of welding alloys, different manufacturers have different production techniques, which will also affect the quality of solder.
Our company has carefully selected the high-quality pure tin from the Yunnan General Corporation and used our proprietary production technology and processes to produce the best quality solder. The welding rod produced by our company not only conforms to American industrial standard QQS571E, German industrial standard DIN1707, Japanese jis-z3282 industrial standard and Chinese national standard, but also exceeds the above standards.
Wave soldering is to make the soldering surface of the board directly contact with high-temperature liquid tin for welding purposes. The high-temperature liquid tin maintains a slope, and the liquid tin forms a wave-like phenomenon by special means, so it is called "wave soldering". The main material is solder bars.

Wave soldering refers to the melting of solder (lead-tin alloy) through an electric pump or electromagnetic pump into a solder peak required by the design, or by injecting nitrogen into the solder pool to pre-load components. The printed board passes solder peaks to achieve soldering of the mechanical and electrical connections between the soldered ends of the components or between the leads and the printed board pads.

Wave soldering process: Insert the component into the corresponding component hole → pre-coat flux → preheat (temperature 90-100 ° C, length 1-1.2 m) → wave soldering (220-240 ° C) cooling → remove excess plug foot → check .

The reflow process is a process of soldering the solder joints of the surface mount components or the mechanical and electrical connections between the leads and the printed circuit board pads by remelting the cream solder pre-dispensed onto the printed circuit board pads. .

Wave soldering has a new welding process as people become more aware of environmental protection. In the past, tin-lead alloys were used, but lead is a heavy metal that is very harmful to the human body. This led to the lead-free process, using * tin-silver-copper alloy * and special flux, and the soldering temperature required a higher preheating temperature.

Perforated (TH) or hybrid technology boards, such as televisions, home audio and video equipment, and digital set-top boxes, are still used in most products that do not require miniaturization and high power, and are still using perforated components, so peaks are needed. weld. From a process point of view, the wave soldering machine can only provide a few basic equipment operating parameter adjustments.
Sn63Pb37、Sn60Pb40、Sn55Pb45
Suitable for wave soldering and manual dip soldering, widely used in high-demand soldering of electronic circuit boards, electronic products, home appliances, electricians, electrical appliances, precision instruments and meters.

Sn50Pb50、Sn45Pb55、Sn40Pb60
Suitable for Manual dip soldering, widely used in general electronic products, home appliances, electrical appliances, instrumentation and other products welding

Sn35Pb65、Sn30Pb70、Sn25Pb70、Sn20Pb80
Suitable for welding of electrical appliances, general hardware machinery, automobile water tanks, energy-saving lamps, cable joints, batteries, etc.

Sn99.3Cu0.7
A lower cost, most commonly used lead-free solder material for general lead-free soldering

Sn96.5Ag3.0Cu0.5、Sn97Ag3.0、Sn99Ag0.3Cu0.7
High cost, bright solder joints, excellent performance and excellent for high-demand soldering

High temperature Sn99.3Cu0.7
Low cost, suitable for welding high temperature resistant products such as transformers, induction cooker coils, enamel coils, etc.

Model

ingredient

Melting point °C

Operating temperature  °C

Density g/cm3

63A

Sn63Pb37

183℃

240-250℃

8.4

60A

Sn60Pb40

183-190℃

250-260℃

8.5

55A

Sn55Pb45

183-203℃

260-280℃

8.7

50A

Sn50Pb50

183-215℃

280-300℃

8.9

45A

Sn45Pb55

183-221℃

280-320℃

9.1

40A

Sn40Pb60

185-235℃

295-325℃

9.3

35A

Sn35Pb65

185-245℃

300-330℃

9.5

30A

Sn30Pb70

185-255℃

305-340℃

9.7

25A

Sn25Pb75

185-265℃

310-350℃

9.9

20A

Sn20Pb80

185-275℃

315-355℃

10.1

SC07

SnCu0.7

227℃

270-300℃

70

SAC305

SnAg3.0Cu0.5

217℃

260-280℃

78

SAC3

SnAg3.0

SAC307

SnAg0.3Cu0.7

high temperature
SC07

SnCu0.7

227℃

450-500℃

70